Proses SMT Teknologi Mount Surface

Perhimpunan satu sisi
Incoming material inspection => Silk screen solder paste (sMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Inspection =>Kerja semula
Perhimpunan dua sisi
A: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD PCB Silk screen solder paste (sMD glue) on PCB B side => SMD => Drying => Reflow soldering (preferably only on B side => Cleaning => Inspection =>Kerja semula) .
B: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD => Drying (curing) => Reflow soldering on A side => Cleaning => Flip board => SMD glue on PCB B side => SMD => Curing => Wave soldering on B side => Cleaning => Inspection =>Kerja semula)
Proses ini sesuai untuk pematerian reflow pada PCB sisi dan gelombang pematerian pada sisi b . Proses ini sesuai untuk SMD yang dipasang di sisi B PCB apabila hanya ada SOT atau SOIC (28) pin atau kurang .
Proses pemasangan campuran satu sisi
Incoming material inspection => Screen printing solder paste on the A side of the PCB (applying SMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Plug-in => Wave soldering => Cleaning => Inspection =>Kerja semula
Proses pemasangan campuran dua sisi
A: Incoming material inspection => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Plug-in on the A side of the PCB => Wave soldering => Cleaning => Inspection =>Kerja semula
Sapukan terlebih dahulu dan kemudian masukkan, yang sesuai untuk keadaan di mana terdapat lebih banyak komponen SMD daripada komponen diskret .
B: Incoming material inspection => Plug-in on the A side of the PCB (pin bending) => Flip board => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection =>Kerja semula
Masukkan terlebih dahulu dan kemudian memohon, yang sesuai untuk keadaan di mana terdapat lebih banyak komponen diskret daripada komponen SMD .
C: Incoming material inspection => PCB A side screen printing solder paste => SMD => Drying => Reflow soldering => Plug-in, pin bending => Flip board => PCB B side SMD glue => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection =>Mengolah semula pemasangan campuran sisi, b smd .
D: Incoming material inspection => PCB B side SMD glue => SMD => Curing => Flip board => PCB A side screen printing solder paste => SMD => Reflow soldering => Plug-in => Wave soldering => Cleaning => Inspection => Rework A side mixed assembly, B side SMD. First paste SMD on both sides, reflow soldering, then plug-in, wave soldering E: Incoming material inspection => Silk screen solder paste (smear patch glue) on the B side of the PCB => Smear => Drying (curing) => Reflow soldering => Flip board => Silk screen solder paste on the A side of the PCB => Smear => Drying = Reflow soldering 1 (local soldering can be used) => Plug-in => Wave soldering 2 (if there are few plug-in components, manual soldering can be used) => Cleaning => Inspection =>Mengolah semula pemasangan sisi, pemasangan campuran sisi b .
Proses perhimpunan dua sisi
A: Pemeriksaan bahan masuk, tampal solder skrin sutera (gam patch smear) di sebelah PCB, smear, pengeringan (pengawetan), pematerian reflow sampingan, pembersihan, papan flip; Tampal Solder Skrin Silk (Smear Patch Glue) di bahagian B PCB, smear, pengeringan, pematerian reflow (sebaik -baiknya hanya untuk sisi B, pembersihan, pemeriksaan, kerja semula)
Proses ini sesuai untuk pemasangan SMD besar seperti PLCC di kedua -dua belah PCB .
B: Pemeriksaan bahan masuk, tampal solder percetakan skrin di sisi PCB (memohon gam SMD), SMD, pengeringan (pengawetan), pematerian reflow di sisi A, pembersihan, dan membalikkan; Memohon gam SMD di sisi B PCB, SMD, menyembuhkan, pematerian gelombang pada sisi B, pembersihan, pemeriksaan, dan kerja semula) Proses ini sesuai untuk reflow di sisi A PCB .